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Method for manufacturing chip pkg structure [(10)CN102163558B]

[Category : - ELECTRONICS]
[Viewed 75 times]

The invention relates to a method for manufacturing a chip packaging structure. The manufacturing method comprises the following steps of: (a) providing a substrate, wherein the substrate is provided with at least one conductive hole; (b) arranging the substrate on a carrier; (c) removing partial substrate to expose the conductive hole, and forming at least one penetration guide hole; (d) arranging a plurality of chips on the surface of the substrate, and electrically connecting the chips to the penetration guide hole of the substrate; (e) forming a coating material; (f) removing the carrier;(g) carrying out a chip bonding process; (h) removing the coating material; and (i) forming a protective material. Thus, the carrier and the coating material can ensure the substrate to be difficult to warp in a process.

Patent publications:

CN 102163558

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rayfw (Taiwan)

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