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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

[Category : - ELECTRONICS]
[Viewed 71 times]

A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a first substrate, a second substrate, and a barrier structure. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface facing the second surface of the first substrate. The first substrate electrically bonds to the second substrate through a conductive terminal disposed between the second surface of the first substrate and the first surface of the second substrate. The barrier structure is disposed adjacent to the first surface of the first substrate.

Patent publications:

 US 11443997
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Seller:

rayfw (Taiwan)

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