PatentAuction.com lists patented inventions available for sale or licensing. Inventors can list their patented inventions (or patent pending) for sale. New inventions for sale are added on a daily basis !
Home    List your patent    My account     Help     Support us    

SEMICONDUCTOR PKG STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

[Category : - ELECTRONICS]
[Viewed 82 times]

A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.

Patent publications:

 US 11424212
Asking price:

Make an offer

Rate this patent

Like Great invention
Viewed: 82 times

Seller:

rayfw (Taiwan)

Ask a question
or start a negotiation

Contact the seller

Share on social media








[ Home | List a patent | Manage your account | F.A.Q.|Terms of use | Contact us]

Copyright PatentAuction.com 2004-2017
Page created at 2025-04-03 10:14:17, Patent Auction Time.