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SEMICONDUCTOR DEVICE PACKAGE (US 11393775)

[Category : - ELECTRONICS]
[Viewed 69 times]

The present disclosure provides a semiconductor a semiconductor device package includes a substrate, an electronic component disposed on the substrate, a package body disposed on the substrate and encapsulating the electronic component, and a capacitor disposed above the electronic component. The capacitor is exposed from the package body.

Patent publications:

 US 11393775
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rayfw (Taiwan)

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