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SEMICONDUC. DEVICE PKG AND METHOD OF MANUFACTURING THE SAME

[Category : - ELECTRONICS]
[Viewed 68 times]

A semiconductor device package includes a substrate, an air cavity, a radiator, and a director. The substrate has a top surface. The air cavity is disposed within the substrate. The air cavity has a first sidewall and a second sidewall opposite to the first sidewall. The radiator is disposed adjacent to the first sidewall of the air cavity. The director is disposed adjacent to the second sidewall of the air cavity.

Patent publications:

 US 11670836
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Seller:

rayfw (Taiwan)

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