PatentAuction.com lists patented inventions available for sale or licensing. Inventors can list their patented inventions (or patent pending) for sale. New inventions for sale are added on a daily basis !
Home    List your patent    My account     Help     Support us    

SEMICONDUCTOR DEVICE PKG AND METHOD OF MANUFACTURING THE SAME

[Category : - ELECTRONICS]
[Viewed 76 times]

The present disclosure relates to a method of manufacturing a semiconductor device package. The method includes: (a) disposing a support structure on a first substrate; (b) electrically connecting a first electronic component on the first substrate, wherein a portion of the first electronic component is separated from the first substrate by the support structure; (c) heating the semiconductor device package; and (d) removing the support structure.

Patent publications:

 US 11476128
Asking price:

Make an offer

Rate this patent

Like Great invention
Viewed: 76 times

Seller:

rayfw (Taiwan)

Ask a question
or start a negotiation

Contact the seller

Share on social media








[ Home | List a patent | Manage your account | F.A.Q.|Terms of use | Contact us]

Copyright PatentAuction.com 2004-2017
Page created at 2025-04-03 10:22:27, Patent Auction Time.