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PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

[Category : - ELECTRONICS]
[Viewed 69 times]

A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.

Patent publications:

US 11626525

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rayfw (Taiwan)

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