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SEMICONDUCTOR DEVICE PKG AND METHODS OF MANUFACTURING THE SAME

[Category : - ELECTRONICS]
[Viewed 67 times]

A semiconductor device package includes a redistribution layer structure, a lid, a sensing component and an encapsulant. The lid is disposed on the redistribution layer structure and defines a cavity together with the redistribution layer structure. The sensing component is disposed in the cavity. The encapsulant surrounds the lid.

Patent publications:

 US 11524890
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Seller:

rayfw (Taiwan)

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