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SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THE SAME

[Category : - ELECTRONICS]
[Viewed 63 times]

The present invention relates to a semiconductor structure and a method for making the same. The method includes the following steps: (a) providing a first wafer and a second wafer; (b) disposing the first wafer on the second wafer; (c) removing part of the first wafer, so as to form a groove; (d) forming a through via in the groove; and (e) forming at least one electrical connecting element on the first wafer. Therefore, the wafers are penetrated and electrically connected by forming only one conductive via, which leads to a simplified process and a low manufacturing cost,

Patent publications:

 US 8778791
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Seller:

rayfw (Taiwan)

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