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SEMICON. PKG AND METHOD OF MANUFACTURING THE SAME (US 10032652)

[Category : - ELECTRONICS]
[Viewed 61 times]

The present disclosure relates to semiconductor packages and methods of manufacturing the same. In an embodiment, the semiconductor package includes a substrate, a semiconductor element, at least one connecting element, and an encapsulant. The semiconductor element is mounted to the substrate. The connecting element is disposed on the substrate and adjacent to the semiconductor element. The encapsulant covers at least a portion of the semiconductor element and at least a portion of the connecting element and defines at least one first groove surrounding the connecting element.

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 US 10032652
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rayfw (Taiwan)

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