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Semiconductor device and method for manufacturing... (US 10103107)

[Category : - ELECTRONICS]
[Viewed 62 times]

A semiconductor device includes at least one base element, at least one passivation layer, at least one circuit layer and at least one light absorbing layer. The base element includes at least one conductive pad. The passivation layer is disposed on the base element. The circuit layer is electrically connected to the conductive pad and disposed in the passivation layer. The light absorbing layer is disposed on the circuit layer.

Patent publications:

 US 10103107
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rayfw (Taiwan)

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