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SEMICON. PKG DEVICE AND METHOD OF MANUFACTURING... (US 10332849)

[Category : - ELECTRONICS]
[Viewed 59 times]

A semiconductor package device includes: (1) a substrate having a first surface; (2) a permeable element including a first portion disposed on the first surface of the substrate, a second portion protruding from the first portion, and a third portion disposed on the second portion and contacting the second portion of the permeable element; (3) a first electrical element disposed on the substrate and surrounded by the second portion of the permeable element; and (4) a coil disposed on the substrate and surrounding the second portion of the permeable element.

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US 10332849

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