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SEMICON. PKA DEVICE AND METHOD OF MANUFACTURING... (US 10074622)

[Category : - ELECTRONICS]
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A semiconductor package device includes a substrate, a first package body, a permeable element and a coil. The substrate includes a first surface. The first package body encapsulates the first surface of the substrate. The permeable element includes a first portion disposed on the first surface of the substrate and a second portion disposed on the package body. The coil is within the first package body.

Patent publications:

 US 10074622
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rayfw (Taiwan)

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