Home List your patent My account Help Support us

THERMAL DISSIPATION DEVICE AND SEMICON. PKG DEVICE INCLUDING THEM

[Category : - ELECTRONICS]
[Viewed 58 times]

A thermal dissipation device includes a main body and a support member. The main body has an upper surface, a lower surface opposite to the upper surface, and a lateral surface. The main body defines an injection hole extending through the main body, and includes an inner ring protruding from the upper surface and adjacent to the injection hole and an outer ring protruding from the upper surface and adjacent to the lateral surface. The support member connects to the lateral surface of the main body. An upper surface of the inner ring is higher than an upper surface of the outer ring. A first intersection point between the inner ring and the upper surface of the main body is higher than a second intersection point between the outer ring and the upper surface of the main body.

Patent publications:

US 10074586

Asking price:

Make an offer

Rate this patent

Great invention
Viewed: 58 times

Seller:

rayfw (Taiwan)

Ask a question
or start a negotiation

Contact the seller

Share on social media