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SEMICONDUCTOR LEAD FRAME PACKAGE AND LED PACKAGE

[Category : - ELECTRONICS]
[Viewed 59 times]

The present invention relates to a semiconductor lead frame package and LED package. The semiconductor lead frame package includes a die pad, a lead, a die and an insulator body. The lead is electrically isolated from the die pad. The die is disposed on the die pad and electrically connected to the lead. The insulator body partially encapsulates the die pad and the lead, and has a top surface and a bottom surface, wherein a part of the lead is folded onto the top surface of the insulator body.

Patent publications:

 US 10026676
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Seller:

rayfw (Taiwan)

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