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SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER

[Category : - ELECTRONICS]
[Viewed 63 times]

The present disclosure relates to a semiconductor device package comprising a substrate, a semiconductor device, and a underfill. The substrate includes a top surface defining a mounting area, and a barrier section on the top surface and adjacent to the mounting area. The semiconductor device is mounted on the mounting area of the substrate. The underfill is disposed between the semiconductor device and the mounting area and the barrier section of the substrate. A contact angle between a surface of the underfill and the barrier section is greater than or equal to about 90 degrees.

Patent publications:

 US 10217649
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Viewed: 63 times

Seller:

rayfw (Taiwan)

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