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Embedded circuit substrate and manufacturing method

[Category : - ELECTRONICS]
[Viewed 237 times]

An embedded circuit substrate including a core structure, a first patterned conductive layer, a second patterned conductive layer and a plurality of conductive blocks is provided. The core structure has a first surface and a second surface opposite to each other. The first patterned conductive layer is disposed on the first surface and is embedded in the core structure. The second patterned conductive layer is disposed on the second surface and is embedded in the core structure. The conductive blocks are disposed in the core structure for conducting the first patterned conductive layer and the second patterned conductive layer. In addition, a method of manufacturing the embedded circuit substrate is also provided.

Patent publications:

TW 2008147880

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rayfw (Taiwan)

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