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PoP structure

[Category : - ELECTRONICS]
[Viewed 79 times]

This patent describes a semiconductor package part that aims to address issues related to the docking operation and bridge joint problems in traditional stacking type semiconductor packages. The semiconductor package part includes a first substrate with a first electrical contact and a first protuberance, a conductive pole, a second substrate with a second protuberance and a solder, a chip, and a bonding coat. The conductive pole is electrically connected to the first electrical contact and is coated by the first protuberance. The second substrate has a second electrical contact and is electrically connected to the solder. The bonding coat surrounds the conductive pole and the chip, and the conductive pole is docked with the solder via an accommodating recess. The patent also describes a manufacturing method for the semiconductor package part, involving steps such as providing the first and second substrates, docking them, and forming a bonding coat. The patent further discusses various embodiments and features of the semiconductor package part, including different configurations and design considerations to improve the performance and reliability of the package.

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rayfw (Taiwan)

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