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Process of shielding layer

[Category : - ELECTRONICS]
[Viewed 194 times]

This patent describes a semiconductor device packaging that aims to reduce electromagnetic interference (EMI) while avoiding damage to the engagement/ball pad of the semiconductor device. The packaging includes a substrate with an earth element exposed on the side surface, component placement on the upper surface, and a packaging body covering the upper surface and the substrate. An electromagnetic interference (EMI) shielding case covers the upper surface and side surface of the packaging body, as well as a portion of the substrate's side surface. The method of manufacturing the semiconductor device packages involves attaching electronic components to the substrate, forming a packaging body, and applying conductive layers to specific areas. The patent also details various techniques for forming the EMI shielding cases and the use of adhesives to protect the earth element during the manufacturing process.

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rayfw (Taiwan)

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