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Cutting jig

[Category : - ELECTRONICS]
[Viewed 184 times]

This patent describes a semiconductor package part, a cutting smelting tool, and a method for manufacturing the semiconductor package part. The semiconductor package part includes a substrate, a semiconductor chip, a packaging body, electrical contacts, and a heat sink. The cutting smelting tool is used to cut the encapsulating structure and includes an air chamber, an aspirating unit, a contact holding tank, and barricades. The method involves setting the encapsulating structure on the cutting smelting tool and unifying the encapsulating structure to form a semiconductor package part. The tool and method aim to prevent damage to the associativity between the heat sink and packaging body during the cutting process. The patent also discusses the design and configuration of the cutting smelting tool to ensure secure placement and cutting of the encapsulating structure.

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rayfw (Taiwan)

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