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PoP structure with adhesion layer

[Category : - ELECTRONICS]
[Viewed 216 times]

This patent describes a semiconductor package part and a method for manufacturing the same. The semiconductor package part includes a first substrate, electrical connection elements, a packaging body, a second substrate, conductive poles, electrical contacts, and a bonding coat. The method involves forming the electrical connection elements, coating the packaging body, providing the second substrate with conductive poles and electrical contacts, and docking the first and second substrates. The bonding coat is formed between the packaging body and the second substrate, providing mechanical strength and protecting the conductive poles. The patent addresses issues related to docking accuracy and mechanical strength of electrical connection elements in semiconductor package parts.

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rayfw (Taiwan)

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