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Dielectric structure with different inside diameter

[Category : - ELECTRONICS]
[Viewed 198 times]

The invention relates to a semiconductor packaging piece and a manufacturing method thereof. The semiconductor packaging piece comprises a chip, a conductive layer, a negative dielectric layer and anelectrical contact, wherein the chip is provided with an active surface; the conductive layer is electrically connected with the active surface; the negative dielectric layer covers the conductive layer and is provided with an open hole, the open hole exposes a part of the conductive layer, the open hole is provided with a minimum inside diameter, a top inside diameter and a bottom inside diameter, and the minimum inside diameter is located between the bottom inside diameter and the top inside diameter; and the electrical contact is formed in the open hole.

Patent publications:

CN 107658284

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rayfw (Taiwan)

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