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Pads with different width

[Category : - ELECTRONICS]
[Viewed 190 times]

The invention discloses a semiconductor packaging part and a manufacturing method of the semiconductor packaging part. The semiconductor packaging part comprises a first substrate, first connecting pads, second connecting pads, a second substrate, a plurality of conductive columns and a plurality of welding fluxes. The second connecting pads and the first connecting pads are formed on the upper surface of the first substrate; the conductive columns are formed on the lower surface of the second substrate; the welding fluxes are formed at the ends of the corresponding conductive columns and are in abutting joint with the second connecting pads and the first connecting pads, and the volumes of the welding fluxes are equal. The distance between the second connecting pads and the conductive columns is larger than that between the first connecting pads and the corresponding conductive columns.

Patent publications:

CN 104377181

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rayfw (Taiwan)

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