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Semiconductor assembly and semiconductor packaging structure

[Category : - ELECTRONICS]
[Viewed 192 times]

The invention relates to a semiconductor assembly and a semiconductor packaging structure having the semiconductor assembly. The semiconductor assembly comprises a conductive component. The conductive component which is located on one projecting conductive-via column and a blocking layer also covers one side wall of the blocking layer. Therefore, the conductive component can protect the projecting conductive-via column and the blocking layer from being damaged. Furthermore, the conductive component has a relatively larger size than the conductive-via column does. As a result, a probe detection technique is easy to perform.

Patent publications:

CN 102176431

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rayfw (Taiwan)

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