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Dielectric layer has different inner diameter

[Category : - ELECTRONICS]
[Viewed 193 times]

The invention relates to a semiconductor package piece and a manufacturing method thereof. The semiconductor package piece comprises a chip, a conductive layer, a negative dielectric layer and an electrical contact. The chip is provided with an active surface. The conductive layer is electrically connected with the active surface. The negative dielectric layer is covered with the conductive layer and provided with an open hole, a part of the open hole is exposed out of the conductive layer, the open hole is provided with a minimum inside diameter, a top inside diameter and a bottom inside diameter, and the minimum inside diameter is located between the bottom inside diameter and the top inside diameter. The electrical contact is formed in the open hole.

Patent publications:

CN 104576576

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rayfw (Taiwan)

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