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Flip-chip bonding method and device

[Category : - ELECTRONICS]
[Viewed 212 times]

The invention provides a flip-chip bonding method and device. The method comprises: placing a first semiconductor chip on a package substrate, wherein a convex block of the first semiconductor chip is contacted with a first surface of the package substrate; fixing the package substrate; and heating the package substrate and the first semiconductor chip, wherein during the heating process, the deformation of the package substrate is restricted, and the first semiconductor chip can freely deform.

Patent publications:

 CN 102842517
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Seller:

rayfw (Taiwan)

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