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Semiconductor package with adhesion layer

[Category : - ELECTRONICS]
[Viewed 54 times]

The invention discloses a semiconductor encapsulation piece and a manufacturing method thereof. The semiconductor encapsulation piece comprises a first substrate, a welding flux convex block, an encapsulation body, a second substrate, an electrical connection element, an electrical joint and an adhesive layer, wherein the welding flux convex block is formed on the surface of the first substrate; the encapsulation body covers the surface of the first substrate and the welding flux convex block, and is provided with an opening; the welding flux convex block is exposed from the opening; the innerdiameter of the opening is equal to the outer diameter of a projection of the welding flux convex block to the opening; the second substrate is provided with a first surface and a second surface which are opposite to each other; the electrical connection element is formed on the first surface of the second substrate and is in butt joint with the welding flux convex block; the electrical joint isformed on the second surface of the second substrate and is electrically connected with the welding flux convex block; and the adhesive layer is formed between the encapsulation body and the second substrate and surrounds the welding flux convex block and the electrical connection element.

Patent publications:

CN 108321142

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rayfw (Taiwan)

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