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Shielding structure with different widths and areas

[Category : - ELECTRONICS]
[Viewed 159 times]

The invention relates to a semiconductor substrate, a semiconductor packaging structure and a manufacturing method thereof. The semiconductor substrate comprises a first surface, a second surface, a third surface, a first conductive part and a second conductive part. The second surface is opposite to the first surface. The third surface extends from the first surface to the second surface. The first conductive part has a first width on the third surface, and has a first area on the first surface. The second conductive part has a second width on the third surface, and has a second area on the first surface, wherein the second width is different from the first width and the second area is different from the first area.

Patent publications:

CN 105720016

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rayfw (Taiwan)

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