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Semiconductor packaging structure and semiconductor process

[Category : - ELECTRONICS]
[Viewed 154 times]

The invention relates to a semiconductor packaging structure and a semiconductor process. The semiconductor packaging structure comprises a first substrate, a second substrate, a grain, a plurality of internal connecting elements, and a coating material. The internal connecting elements are connected with the first substrate and the second substrate. Each of the internal connecting elements comprises an upper part and a lower part, wherein the upper part and the lower part are jointed to form a joint part, and the lower part has a shoulder which surrounds the joint part. The coating material coats the internal connecting elements. Therefore, warpage of the second substrate during reflow soldering is avoided, and the peeling-off problem of the first substrate and the second substrate is solved.

Patent publications:

CN 104701270

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rayfw (Taiwan)

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