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Proximity sensor packaging structure

[Category : - ELECTRONICS]
[Viewed 48 times]

The invention discloses a proximity sensor packaging structure and a manufacturing method thereof. The proximity sensor packaging structure mainly comprises a substrate, an optical emission element, an optical receiving element, a first transparent packaging body, a second transparent packaging body and a non-transparent packaging body, wherein the optical emission element and the optical receiving element are arranged on the substrate; the first transparent packaging body and the second transparent packaging body respectively package the optical emission element and the optical receiving element; a light-emitting part and a light-entering part are respectively arranged on the top surfaces of the first transparent packaging body and the second transparent packaging body; the non-transparent packaging body packages part of the first transparent packaging body and part of the second transparent packaging body, and exposes the light-emitting part and the light-entering part. The non-transparent packaging body is packed in such a way that an elastic part is arranged in a die and is propped against the surface of the transparent packaging body of the optical component, and the proximity sensor packaging structure can replace the assembly way of a housing with a lens, simplifies the structure and the assembly way, and is beneficial to miniaturization.

Patent publications:

CN 103400836

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rayfw (Taiwan)

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