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LED (Light Emitting Diode) packaging structure

[Category : - ELECTRONICS]
[Viewed 171 times]

The invention discloses an LED (Light Emitting Diode) packaging structure and a manufacturing method thereof. A runner groove is arranged on an LED substrate and an annular runner is correspondingly arranged on a mould, and then the LED substrate and the mould are assembled for injecting colloid, so that a sealing glue ring is formed by each substrate unit of the LED substrate, the time for manufacturing the sealing glue ring is greatly reduced and the time for constructing the LED packaging structure is reduced.

Patent publications:

 CN 103050613
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Viewed: 171 times

Seller:

rayfw (Taiwan)

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