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Embedded circuit substrate

[Category : - ELECTRONICS]
[Viewed 158 times]

The invention discloses an embedded circuit substrate and a manufacturing method thereof. The embedded circuit substrate comprises a core structure, a first patterned conductive layer, a second patterned conductive layer and a plurality of conductive blocks. The core structure is provided with a first surface and a second surface opposite to each other. The first patterned conductive layer is arranged on the first surface and embedded in the core structure. The second patterned conductive layer is arranged on the second surface and embedded in the core structure. The conductive blocks are arranged in the core structure and are used for conducting the first patterned conductive layer and the second patterned conductive layer. With pressing-in manner, the patterned conductive layer and the conductive hole are simultaneously embedded in a dielectric layer so that the embedded circuit substrate has a relatively flat surface.

Patent publications:

CN 101958306

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rayfw (Taiwan)

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