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Semiconductor encapsulation piece and manufacturing method thereof

[Category : - ELECTRONICS]
[Viewed 153 times]

Provided are a semiconductor encapsulation piece and a manufacturing method of the semiconductor encapsulation piece. The semiconductor encapsulation comprises a chip, an encapsulation body, electric conduction pieces and screened films. The chip comprises an active face and a back face and comprises a heat dissipation piece. The heat dissipation piece extends from the active face of the chip to the back face of the chip. The encapsulation body coats the chip and comprises an outer lateral face, an upper surface, a lower surface and heat dissipation holes. The heat dissipation holes extend from the heat dissipation piece to the upper surface of the encapsulation body. The electric conduction pieces are formed on the active face of the chip and the lower surface of the encapsulation body. The screened films are formed on the upper surface of the encapsulation body and the outer lateral face of the encapsulation body and are connected with the electric conduction pieces.

Patent publications:

CN 103035591

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rayfw (Taiwan)

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