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Electronic device comprising micro-electro-mechanical system

[Category : - ELECTRONICS]
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The invention relates to an electronic device and a manufacturing method thereof. The electronic device comprises a first substrate, at least one bare chip, a micro-electro-mechanical microphone and a packaging material, wherein the first substrate comprises an upper surface and a lower surface opposite to the upper surface; the at least one bare chip is arranged in the first substrate, and the bare chip comprises an active surface and a back surface opposite to the active surface; the micro-electro-mechanical microphone comprises an active surface and a back surface opposite to the active surface, a sealed space is formed by the back surface and the upper surface of the first substrate, and the active surface of the micro-electro-mechanical microphone is electrically connected with the bare chip through the first substrate; and the packaging material covers at least part of the upper surface of the first substrate and the micro-electro-mechanical microphone, and is provided with an opening for exposing the active surface of the micro-electro-mechanical microphone.

Patent publications:

CN 105282670

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rayfw (Taiwan)

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