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Semiconductor package structure with reinforced metal layer

[Category : - ELECTRONICS]
[Viewed 188 times]

The invention provides a semiconductor package structure and a manufacturing method thereof. The manufacturing method of the semiconductor package structure comprises the following steps that: a chip and a plurality of first electrical connection components are arranged on the first surface of a substrate, and a package colloid and a reinforced metal layer are pressed onto the first surface of the substrate to coat the chip and the first electrical connection components; then, at least one orifice is formed in the reinforced metal layer; and then at least one open pore is formed in the package colloid exposed from the orifice to be used for exposing the first electrical connection components. The semiconductor package structure can be used as a bottom package body in a stacked package body (POP) to conform to a thin type requirement, and the structural strength can be ensured.

Patent publications:

CN 102664170

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rayfw (Taiwan)

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