---

Home    List your patent    My account     Help     Support us    

---

Semiconductor device with a thermal conductive structure

[Category : - ELECTRONICS]
[Viewed 274 times]

A semiconductor device package includes a semiconductor die and an anisotropic thermal conductive structure. The semiconductor die includes a first surface, a second surface opposite to the first surface and edges connecting the first surface to the second surface. The anisotropic thermal conductive structure has different thermal conductivities in different directions. The anisotropic thermal conductive structure includes at least two pairs of film stacks, and each pair of the film stacks comprises a metal film and a nano-structural film alternately stacked. The anisotropic thermal conductive structure comprises a first thermal conductive section disposed on the first surface of the semiconductor die, and the first thermal conductive section is wider than the semiconductor die.

---

---

---

---

[ Home | List a patent | Manage your account | F.A.Q.|Terms of use | Contact us]

Copyright PatentAuction.com 2004-2017
Page created at 2025-04-07 21:30:12, Patent Auction Time.