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CHIP STRUCTURE, WAFER STRUCTURE AND PROCESS OF FABRICATING CHIP

[Category : - ELECTRONICS]
[Viewed 256 times]

A chip structure includes a substrate and a stress buffer layer. The substrate has a first surface and a second surface opposite to the first surface. The stress buffer layer is disposed on the periphery of the substrate and located in at least one of the first surface and the second surface of the substrate.

Patent publications:

 US 8501579
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rayfw (Taiwan)

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