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SEMICONDUCTOR PACKAGE WITH DILATANTS LAYERS

[Category : - ELECTRONICS]
[Viewed 244 times]

A semiconductor package includes a substrate, an electronic component and a first dilatant layer. The electronic component is disposed on the substrate. The electronic component has a top surface, a bottom surface opposite to the top surface and a lateral surface extending between the top surface and the bottom surface. The first dilatant layer is disposed on the top surface of the electronic component and extends along the lateral surface of the electronic component.

Patent publications:

 US 11302594
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Seller:

rayfw (Taiwan)

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