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SEMICONDUCTOR PACKAGE FOR CONTROLLING WARPAGE

[Category : - ELECTRONICS]
[Viewed 264 times]

A semiconductor structure having a ring. The semiconductor structure includes a substrate, at least one chip, and the ring. The substrate has a first surface. The chip is located on the first surface of the substrate and electrically connected to the substrate. The ring has a first portion and a second portion. In various embodiments, the first and second portions different coefficients of thermal expansion (CTE), and or different cross-sectional widths. In another embodiment, the ring includes a third portion having a CTE different from both the first and second CTEs.

Patent publications:

 US 8629541
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Seller:

rayfw (Taiwan)

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