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Semiconductor device package with an embedded component

[Category : - ELECTRONICS]
[Viewed 226 times]

A semiconductor device package includes an electronic component, a first passivation layer having an inner surface surrounding the electronic component, and a conductive layer disposed on the inner surface of the first passivation layer. The electronic component has a first surface, a second surface opposite the first surface, and a lateral surface extended between the first surface and the second surface. The conductive layer has a relatively rough surface. A method of manufacturing a semiconductor device package is also disclosed.

Patent publications:

 US 11276660
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Seller:

rayfw (Taiwan)

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