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semiconductor package comprising replacement structures

[Category : - ELECTRONICS]
[Viewed 267 times]

A semiconductor package includes a semiconductor die having a first surface and a second surface opposite to the first surface, a conductive wiring layer stacked with the semiconductor die and proximal to the first surface, an encapsulant encapsulating the semiconductor die and stacked with the conductive wiring layer, and a replacement structure exposing from the encapsulant and being free of fillers. A method for manufacturing the semiconductor package is also disclosed in the present disclosure.

Patent publications:

 US 11217498
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Seller:

rayfw (Taiwan)

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