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Micro-mechanical super-miniature piezoresistive pressure sensor

[Category : - ELECTRONICS- HEALTH- DESIGN PATENTS]
[Viewed 976 times]

The utility model relates to a micro-mechanical super-miniature piezoresistive pressure sensor comprising a first silicon-on-insulator (SOI) wafer and a diaphragm which are deposited on a first silicon layer on a first oxide layer. The diaphragm comprises a second SOI wafer equipped with a second silicon layer. The diaphragm and the first SOI wafer are bonded by means of the face-to-face combination of the second silicon layer and the first silicon layer. The diaphragm is provided with one or more openings. The one or more openings expose a part of the second silicon layer and comprise one or more piezoelectric resistors. A trench is arranged in the first silicon layer and the second silicon layer. The trench terminates at the first oxide layer. The trench defines the boundary of the piezoresistive pressure sensor. The piezoresistive pressure sensor comprises the diaphragm. The sensitivity of the super-miniature piezoresistive pressure sensor that can be installed on the far end of a guide wire is improved by means of enhancement technology.

Patent publications:

CN 204373833

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qibinc (United States)

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