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MEMS ultra-small piezoresistive pressure sensor

[Category : - HEALTH]
[Viewed 805 times]

The present invention provides a method for manufacturing one or more ultra-small piezoresistive pressure sensors using silicon wafers. The diaphragm of the piezoresistive pressure sensor is formed by melting and bonding. The piezoresistive pressure sensor can be formed by silicon deposition, photo etching and etching processes.

Patent publications:

 CN 104865001
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Seller:

qibinc (United States)

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