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System And Method For Low Temperature Joining Of Dissimilar Metals

[Category : - OTHER- CHEMISTRY]
[Viewed 1095 times]

Application No.: 201721047327
Grant No.: 305488

In some applications, the gas needs to be passed through the Aluminum Capillary across the dissimilar metal cup to the pressurized chamber and the joint of Aluminum Capillary and the plate should be leakage free. Aluminum Capillary is passed through dissimilar metal cup and the movement is mechanically restricted by formation of capillary heading at both sides of cup. But the heading formation doesn’t ensure airtight joint and hence needs to be sealed. Soldering proves to be a cost effective and low temperature solution to seal the capillary heading. But using soldering process to join and seal the gap between Aluminum capillary to dissimilar metal cup is a difficult task.

Sealing and joining of Aluminum capillary heading to metal cup is a difficult task as the difference of melting point of both the metal is very high and the softening temperature of Aluminum is low. As brazing is done above 450?C and the softening temperature of Aluminum is 300-480?C, melting temperature of Aluminum is around 650?C and the thickness of the capillary is too low, brazing is not possible. Also for mass manufacturing, a cost-effective process would be required with no post process residue. By soldering process with optimized process, these problems can be solved.

System and method for sealing and joining the Aluminum Capillary heading to the dissimilar metal cup is provided. The soldering process includes placing the Aluminum Capillary headed Metal Cup on the fixture with a mesh below, placing the flux dipped solder ring on metal cup around the Aluminum capillary heading, and applying heat from below the mesh of fixture for soldering to seal and join the Aluminum Capillary heading to Dissimilar Metal Cup.

Main Claims:
i. System and Methods for Sealing and joining the Aluminum Capillary heading to dissimilar metal
ii. Low temperature joining of Aluminum Capillary to dissimilar metal
iii. Low cost and fast process for bulk manufacturing
iv. Implementing brazing process but below 450°C
v. Using Eutectic Alloy Solder as soldering material for soldering Aluminum to dissimilar metal

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kstudio (India)

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