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METHOD TO REALIZE FLUX FREE INDIUM BUMPING

[Category : - OTHER]
[Viewed 1261 times]

A method to realize flux free indium bumping process includes several steps including substrate metallization, contact holes opening, underbump metallization (UBM) layer thickening, indium bump preparation and Ag layer coating. The method can be used in the occasion for some special application, e.g., the packaging of the photoelectric chip (with optical lens), MEMS and biological detection chip, where the usage of flux is prohibited.

Patent publications:

 US 8900986
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mems (China)

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