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PATTERNED WAFER INSPECTION SYSTEM

[Category : - ELECTRONICS]
[Viewed 1117 times]

A method and system for inspecting a surface of a material having a repeating pattern of relative work function. The method and system processes sensor data to identify data characteristic of the repeating pattern, and the sensor data is then further processed to remove the data characteristic of the repeating data, leading to a characteristic of non-uniformities of the material surface.

Patent publications:

 US 8275564
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aarontc (United States)

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