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TSV Backside Reveal Structure and Exposing Process

[Category : - Computers and computer accessories ]
[Viewed 1245 times]

A TSV exposing process is provided, including: performing a mechanical grinding process on the substrate back surface of a substrate with a TSV conductive column, a liner between the substrate and the TSV conductive column performing a first and a second chemical mechanical polishing process on the grinded substrate back surface then performing an etching on the substrate back surface, and making the TSV backside reveal more than 10 [mu]m.

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